Nearfield levanta US$380 millones para metrología de chips IA. El punto central es claro: The Dutch company closed a $380 million Series D at a $1.6 billion valuation, calling it the largest deep-tech round in Dutch history.
La segunda capa vuelve la historia más relevante: Its QUADRA platform uses non-destructive, high-throughput 3D nanoscale metrology to inspect trenches, sidewalls, vias and stacked structures in advanced chips.
Ahora lo importante será la ejecución. As AI chips push manufacturing toward 3D architectures, yield control makes metrology equipment a strategic bottleneck, not a back-office tool.
Fuentes: CocoLoop e informes públicos citados en el artículo original