Nearfield lève 380 M$ pour la métrologie des puces IA. Le point central est clair : The Dutch company closed a $380 million Series D at a $1.6 billion valuation, calling it the largest deep-tech round in Dutch history.
La deuxième lecture rend l’affaire plus importante : Its QUADRA platform uses non-destructive, high-throughput 3D nanoscale metrology to inspect trenches, sidewalls, vias and stacked structures in advanced chips.
La suite dépendra surtout de l’exécution. As AI chips push manufacturing toward 3D architectures, yield control makes metrology equipment a strategic bottleneck, not a back-office tool.
Sources: CocoLoop et les sources publiques citées dans l’article original