Nearfield capta US$380 mi para metrologia de chips de IA. O ponto central é direto: The Dutch company closed a $380 million Series D at a $1.6 billion valuation, calling it the largest deep-tech round in Dutch history.
A segunda camada torna a história mais relevante: Its QUADRA platform uses non-destructive, high-throughput 3D nanoscale metrology to inspect trenches, sidewalls, vias and stacked structures in advanced chips.
O que importa agora é execução. As AI chips push manufacturing toward 3D architectures, yield control makes metrology equipment a strategic bottleneck, not a back-office tool.
Fontes: CocoLoop e reportagens públicas citadas no artigo original