TSMC News and Analysis

2 verified stories covering TSMC, product updates and industry developments.

TSMC and ASML will shift High NA EUV photomasks from 6 inches to 12 inches, aiming to eliminate stitching, raise throughput, and cut costs by 2033.

AI chip demand has pushed TSMC capacity toward 2028, sending BYD, Google, AMD and Tesla to explore Samsung foundry capacity.