Huawei Shifts to Folded Chip Design, Kirin to Debut Late 2025
Huawei unveils Tau Scaling Law and LogicFolding architecture to bypass EUV lithography restrictions, aiming for equivalent 1.4nm transistor density by 2030.
2 verified stories covering US-China tech war, product updates and industry developments.
Huawei unveils Tau Scaling Law and LogicFolding architecture to bypass EUV lithography restrictions, aiming for equivalent 1.4nm transistor density by 2030.
The U.S. Department of Justice has charged three individuals, including a Supermicro co-founder, with conspiring to illegally export approximately $2.5 billion worth of NVIDIA AI servers to China in what is described as the largest AI chip smuggling case in U.S. history.